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BEATING THE HEAT IN ELECTRONICS IMPROVES PERFORMANCE + RELIABILITY 

Heat management is a significant challenge in electronics where higher processing speed equals higher heat. Components that overheat exhibit poor performance and a shortened lifespan, which is particularly problematic as devices become increasingly smaller and components get closer together.

 

Consequently, heat dissipation is one of the top design considerations in the electronics of today and tomorrow. In contrast to conventional conduction and convection approaches laser functionalized surfaces that significantly increase surface area can accelerate cooling by factors up to 1,000 times or more, without any negative impact on system performance and SWaP (strength, weight and power).

 


 

ThermOptical Cooling Technologies' core technology is a patented nano surface engineering technique (US 8,238.098 B1) developed by Victor Rivas, Founder and Chief Technology Officer. The technology uses ultrafast short pulse laser systems to form and create nanostructures on metallic and nonmetallic surfaces that increases surface area for better heat dissipation and emissivity (effectiveness in emitting energy as thermal radiation) in thermal spreaders, heat sinks and heat exchangers for electronics.

 

The World Intellectual Property Organization approved all 13 claims of the invention as being industrially applicable, novel, and inventive. 

This patent is available for licensing.  Please contact Dr. Delore Zimmerman for additional information. delore@praxissg.com
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